Encompass SCM Inspection and Metrology
- All of our ISO-9000 certified SCMs can provide for 100% inspection and reporting on all key parameters including:
- Type, Thickness, Resistivity (RRG), TTV, TIR, STIR* Bow, Warp, Particles (including LLS and COP’s**), and Surface Metals reported on Lot basis only.
- Certificate of Analysis or Conformance available on all of EDS Virgin Test Wafers
* STIR, limited by diameter and SCM metrology, process capability available on 300mm and 200mm.
** COP reporting and measurement only available on 300mm diameter material.
Surface Metals Testing and Reporting Capabilities:
- All of our SCM’s use internal controlled Agilent 7500S for silicon wafer surface metals and organics testing
- Test Method: VPD ICPMS
- Silicon wafers are tested using a VPD chamber and an automated fluid scanner
- Detection Limit: 1 e8 atoms/cm
- Elements: Al, Ag, As , Ca, Co, Cr, Cu, Fe, K, Mg, Mn, Na, Ni, Pb, Ta, W and Zn